Micro SMD is a standard thin product. The one side of the SMD chip has a welding protruding (solder bump). The production process of SMD micro steps including standard wafer manufacturing, wafer passivation, I/O pad eutectic welding deposition, convex back grinding (only for thin products), protective coating, packaging test, wafer selection platform for laser marking and packaging, belts and roll form, finally using standard surface mount technology (SMT) in the PCB assembly.

Micro SMD is a wafer level chip size package (WLCSP). It has the following features:

The package size and die size size;

The smallest I/O pin;

3 without underfill material;

The line spacing is 0.5mm;

Without the adapter plate in the chip and PCB (interposer).